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atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 standard features ? low-voltage and standard-voltage operation ? v cc = 1.7v to 5.5v ? internally organized as 512 x 8 (4k), or 1024 x 8 (8k) ? i 2 c-compatible (2-wire) serial interface ? schmitt trigger, filtered inputs for noise suppression ? bidirectional data transfer protocol ? 1mhz (2.5v, 2.7v, 5v), 400khz (1.7v) compatibility ? write protect pin for hardware data protection ? 16-byte page write mode ? partial page writes allowed ? self-timed write cycle (5ms max) ? high-reliability ? endurance: 1,000,000 write cycles ? data retention: 100 years ? green package options (pb/halide-free/rohs compliant) ? 8-lead pdip, 8-lead soic, 8-lead tssop, 8-pad udfn, 5-lead sot23, and 8-ball vfbga ? die options: wafer form and tape and reel description the atmel ? at24c04c and at24c08c provides 4096/8192 bits of serial electrically erasable and programmable read-only memory (eeprom) organized as 512/1024 words of eight bits each. the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. at24c04c/08c is available in space-saving 8-lead pdip, 8-lead jedec soic, 8-lead tssop, 8-pad udfn , 5-lead sot23, and 8-ball vfbga packages and is accessed via a 2-wire serial interface. atmel at24c04c and atmel at24c08c i 2 c-compatible, (2-wire) serial eeprom 4-kbit (512 x 8), 8-kbit (1024 x 8) datasheet
2 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 table 1. pin configuration pin name function nc no connect a 1 address input (4k only) a 2 address input sda serial data scl serial clock input wp write protect gnd ground v cc power supply note: 1. for use of 5-lead sot23, the software a2 and a1 bits in the device address word must be set to zero to properly communicate. 1 2 3 4 8 7 6 5 nc a 1 /nc a 2 gnd v cc wp scl sda 8-lead soic 1 2 3 4 8 7 6 5 nc a 1 /nc a 2 gnd v cc wp scl sda 8-lead pdip 1 2 3 5 4 scl gnd sda wp v cc 5-lead sot23 1 2 3 4 8 7 6 5 v cc wp scl sda nc a 1 /nc a 2 gnd 8-lead udfn bottom view v cc wp scl sda nc a 1 /nc a 2 gnd 1 2 3 4 8 7 6 5 8-ball vfbga bottom view 1 2 3 4 8 7 6 5 nc a 1 /nc a 2 gnd v cc wp scl sda 8-lead tssop
3 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 1. absolute maximum ratings 2. block diagram operating temperature ........................?55 ? c to +125 ? c storage temperature ...........................?65 ? c to +150 ? c voltage on any pin with respect to ground .............................?1.0v to +7.0v maximum operating voltage ................................. 6.25v dc output current................................................ 5.0ma *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. start stop logic data word addr/counter row decoder device address comparator data latches d out / ack logic column decoder eeprom array serial control logic high voltage pump & timing serial mux read/write enable comp load inc v cc gnd wp scl sda d out d in a 2 a 1
4 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 3. pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. device/page addresses (a 2 and a 1 ): the at24c04c uses the a 2 and a 1 inputs for hard wire addressing allowing a total of four 4k devices to be addressed on a single bus system. pin 1 is a no connect and can be connected to ground (see section 6. ?device addressing? on page 10 ). the at24c08c only uses the a 2 input for hardware addressing and a total of two 8k devices may be addressed on a single bus system. the a 0 and a 1 pins are no connects and can be connected to ground (see section 6. ?device addressing? on page 10 ). write protect (wp): at24c04c/08c has a write protect pin that provides hardware data protection. the write protect pin allows normal read/write operations when connected to ground (gnd). when the write protect pin is connected to v cc , the write protection feature is enabled and operates as shown in table 3-1 . table 3-1. write protect wp pin status part of the array protected atmel at24c04c/08c at v cc full array at gnd normal read/write operations
5 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 4. memory organization atmel at24c04c, 4k serial eeprom: internally organized with 32 pages of 16 bytes each, the 4k requires a 9-bit data word address for random word addressing. atmel at24c08c, 8k serial eeprom: internally organized with 64 pages of 16 bytes each, the 8k requires a 10-bit data word address for random word addressing. table 4-1. pin capacitance (1) note: 1. this parameter is characterized and is not 100% tested. table 4-2. dc characteristics note: 1. v il min and v ih max are reference only and are not tested. applicable over recommended operating range from t a = 25c, f = 1.0mhz, v cc = +1.7v to +5.5v symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (a 0 , a 1 , a 2 , scl) 6 pf v in = 0v applicable over recommended operating range from: t ai = ?40c to +85c, v cc = +1.7v to +5.5v (unless otherwise noted) symbol parameter test condition min typ max units v cc1 supply voltage 1.7 5.5 v v cc2 supply voltage 4.5 5.5 v i cc supply current v cc = 5.0v read at 100khz 0.4 1.0 ma i cc supply current v cc = 5.0v write at 100khz 2.0 3.0 ma i sb1 standby current v cc = 1.7v v in = v cc or v ss 1.0 a i sb2 standby current v cc = 5.5v v in = v cc or v ss 6.0 a i li input leakage current v in = v cc or v ss 0.10 3.0 a i lo output leakage current v out = v cc or v ss 0.05 3.0 a v il input low level (1) ?0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol2 output low level v cc = 3.0v i ol = 2.1ma 0.4 v v ol1 output low level v cc = 1.7v i ol = 0.15ma 0.2 v
6 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 table 4-3. ac characteristics note: 1. this parameter is ensured by characterization only. applicable over recommended operating range from t ai = ? 40 ? c to +85 ? c, v cc = +1.7v to +5.5v, cl = 1ttl gate and 100pf (unless otherwise noted) symbol parameter 1.7v 2.5v, 2.7v, 5.0v units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.2 0.4 s t high clock pulse width high 0.6 0.4 s t i noise suppression time 100 50 ns t aa clock low to data out valid 0.1 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start. 1.2 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start setup time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in setup time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop setup time 0.6 .25 s t dh data out hold time 50 50 ns t wr write cycle time 5 5 ms endurance (1) 3.3v, +25 ? c, page mode 1 million write cycles
7 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 5. device operation clock and data transitions: the sda pin is normally pulled high with an external device. data on the sda pin may change only during scl low time periods (see figure 5-4 on page 9 ). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 5-5 on page 9 ). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 5-5 on page 9 ). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in eight bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle. standby mode: the atmel at24c04/08c features a low-power standby mode which is enabled: ? upon power-up ? after the receipt of the stop bit and the completion of any internal operations 2-wire software reset: after an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: 1. create a start bit condition 2. clock nine cycles 3. create another start bit followed by stop bit condition as shown below. the device is ready for next communication after above steps have been completed. figure 5-1. software reset scl 9 start bit start bit stop bit 8 3 2 1 sda dummy clock cycles
8 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 figure 5-2. bus timing scl: serial clock, sda: serial data i/o figure 5-3. write cycle timing scl: serial clock, sda: serial data i/o notes: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. scl sda in sda out t f t high t low t low t r t aa t dh t buf t su.sto t su.dat t hd.dat t hd.sta t su.sta t wr (1) stop condition start condition wordn ack 8th bit scl sda
9 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 figure 5-4. data validity figure 5-5. start and stop definition figure 5-6. output acknowledge sda scl data stable data stable data change sda scl start stop scl data in data out start acknowledge 9 8 1
10 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 6. device addressing standard eeprom access: the 4k and 8k eeprom device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation. the device address word consists of a mandatory ? 1010 ? (0xa) sequence for the first four most significant bits (msb) as shown in figure 8-1 on page 11 . this is common to all the eeprom devices. the 4k eeprom only uses the a2 and a1 device address bits with the third bit being a memory page address bit. the two device address bits must compare to their corresponding hard-wired input pins. the a 0 pin is no connect. the 8k eeprom only uses the a2 device address bit with the next two bits being for memory page addressing. the a2 address bit must compare to its corresponding hard-wired input pin. the a 1 and a 0 pins are no connect. the eighth bit of the device address is the read/write operation select bit. a read operation is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the chip will return to a standby state. for the sot23 package offering, the 4k eeprom software a2 and a1 bits in the device address word must be set to zero to properly communicate. the 8k eeprom software a2 bit in the device address word must be set to zero to properly communicate. 7. write operations byte write: a write operation requires an 8-bit data word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (see figure 8-2 on page 11 ). page write: the 4k and 8k eeprom devices are capable of a 16-byte page write. a page write is initiated in the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 8-3 on page 12 ). the data word address lower four bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than 16 data words are transmitted to the eeprom, the data word address will ?roll over? and previous data will be overwritten. acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the read or write sequence to continue.
11 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 8. read operations read operations are initiated in the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are three read operations: current address read, random address read, and sequential read . current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address ?roll over? during read is from the last byte of the last memory page to the first byte of the first page. the address ?roll over? during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an input zero but does generate a following stop condition (see figure 8-4 on page 12 ). random read: a random read requires a ?dummy? byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 8-5 on page 12 ). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will ?roll over? and the sequential read will continue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see figure 8-6 on page 12 ). figure 8-1. device address figure 8-2. byte write density access area bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 4k eeprom 1 0 1 0 a 2 a 1 p0 r/ w 8k eeprom 1 0 1 0 a 2 p1 p0 r/ w msb lsb sda line s t a r t w r i t e s t o p device address word address data m s b a c k a c k a c k r / w
12 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 figure 8-3. page write figure 8-4. current address read figure 8-5. random read figure 8-6. sequential read sda line s t a r t w r i t e s t o p device address word address (n) data (n) data (n + 1) data (n + x) m s b a c k a c k a c k a c k a c k r / w sda line s t a r t r e a d s t o p device address data m s b a c k n o a c k r / w sda line s t a r t s t a r t r e a d w r i t e s t o p device address device address word address (n) data (n) m s b a c k a c k a c k n o a c k r / w dummy write sda line r e a d s t o p device address data (n) data (n + 1) data (n + 2) data (n + x) a c k a c k a c k a c k n o a c k r / w
13 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 9. ordering code detail atmel designator product family device density device revision shipping carrier option operating voltage 04 = 4k 08 = 8k 24c = standard serial eeprom b or blank = bulk (tubes) t = tape and reel m = 1.7v to 5.5v package device grade or wafer/die thickness h = green, nipdau lead finish, industrial temperature range (-40?c to +85?c) u = green, matte sn lead finish, industrial temperature range (-40?c to +85?c) 11 = 11mil wafer thickness package option p = pdip ss = jedec soic x = tssop ma = udfn st = sot23 c = vfbga wwu = wafer unsawn at24c04c-sshm-b
14 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 10. product markings drawing no. rev. title catalog number truncation at24c04c truncation code ###: 04c at24c08c truncation code ###: 08c note 2: package drawings are not to scale note 1: designates pin 1 package mark contact: dl-cso-assy_eng@atmel.com aaaaaaaa ###m @ atmlhyww 8-lead soic aaaaaaa ###m @ athyww 8-lead tssop ### hm@ yxx 2.0 x 3.0 mm body 8-lead udfn 5-lead sot-23 ###mu ymxx bottom mark top mark 1.5 x 2.0 mm body 8-ball vfbga pin 1 ###u ymxx 8-lead pdip aaaaaaaa ###m @ atmluyww 24c04-08csm b 5/01/12 24c04-08csm, at24c04c and at24c08c package marking information date codes voltages y = year m = month ww = work week of assembly m: 1.7v min 2: 2012 6: 2016 a: january 02: week 2 3: 2013 7: 2017 b: february 04: week 4 4: 2014 8: 2018 ... ... 5: 2015 9: 2019 l: december 52: week 52 country of assembly lot number grade/lead finish material @ = country of assembly aaa...a = atmel wafer lot number u: industrial/matte tin h: industrial/nipdau trace code atmel truncation xx = trace code (atmel lot numbers correspond to code) at: atmel example: aa, ab.... yz, zz atm: atmel atml: atmel at24c04c and at24c08c: package marking information
15 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 11. ordering codes 11.1 atmel at24c04c ordering information notes: 1. b = bulk 2. t = tape and reel ? soic = 4k per reel ? tssop, udfn, sot23, and vfbga = 5k per reel 3. for wafer sales, please contact atmel sales. ordering code lead finish package voltage operation range at24c04c-pum bulk form only (lead-free/halogen-free) 8p3 1.7v to 5.5v industrial temperature (?40 ? c to 85 ? c) at24c04c-sshm-b (1) nipdau (lead-free/halogen-free) 8s1 at24c04c-sshm-t (2) at24c04c-xhm-b (1) 8x at24c04c-xhm-t (2) at24c04c-mahm-t (2) 8ma2 at24c04c-stum-t (2) (lead-free/halogen-free) 5ts1 at24c04c-cum-t (2) (lead-free/halogen-free) 8u3-1 at24c04c-wwu11m (3) ? wafer sale package type 8p3 8-lead, 0.300" wide, plastic dual inline (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8x 8-lead, 4.4mm body, plastic thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, plastic ultra thin dual flat no lead (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline (sot23) 8u3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, die ball grid array (vfbga)
16 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 11.2 atmel at24c08c ordering information notes: 1. b = bulk 2. t = tape and reel ? soic = 4k per reel ? tssop, udfn, sot23, and vfbga = 5k per reel 3. for wafer sales, please contact atmel sales. ordering code lead finish package voltage operation range at24c08c-pum bulk form only (lead-free/halogen-free) 8p3 1.7v to 5.5v industrial temperature (?40 ? c to 85 ? c) at24c08c-sshm-b (1) nipdau (lead-free/halogen-free) 8s1 at24c08c-sshm-t (2) at24c08c-xhm-b (1) 8x at24c08c-xhm-t (2) at24c08c-mahm-t (2) 8ma2 at24c08c-stum-t (2) (lead-free/halogen-free) 5ts1 at24c08c-cum-t (2) (lead-free/halogen-free) 8u3-1 at24c08c-wwu11m (3) ? wafer sale package type 8p3 8-lead, 0.300" wide, plastic dual inline (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8x 8-lead, 4.4mm body, plastic thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, plastic ultra thin dual flat no lead (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline (sot23) 8u3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, die ball grid array (vfbga)
17 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12. packaging information 8p3 ? 8-lead pdip drawing no. rev. title gpc notes: 1. this drawing is for general information only; refer to jedec drawing ms-001, variation ba for additional information. 2. dimensions a and l are measured with the package seated in jedec seating plane gauge gs-3. 3. d, d1 and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch. 4. e and ea measured with the leads constrained to be perpendicular to datum. 5. pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 (0.25 mm). common dimensions (unit of measure = inches) symbol min nom max note d d1 e e1 e l b2 b a2 a 1 n ea c b3 4 plcs a 0.210 2 a2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 d 0.355 0.365 0.400 3 d1 0.005 3 e 0.300 0.310 0.325 4 e1 0.240 0.250 0.280 3 e 0.100 bsc ea 0.300 bsc 4 l 0.115 0.130 0.150 2 top view side view end view package drawing contact: packagedrawings@atmel.com 8p3 d 06/21/11 8p3, 8-lead, 0.300?wide body, plastic dual in-line package (pdip) ptc
18 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12.1 8s1 ? 8-lead jedec soic drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ?1.75 b 0.31 ?0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ?6.20 e 1.27 bsc l 0.40 ?1.27 0? ? 8 e 1 n top view c e1 end view a b l a1 e d side view package drawing contact: packagedrawings@atmel.com 8s1 g 6/22/11 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150?wide body), plastic gull wing small outline (jedec soic) swb
19 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12.2 8x ? 8-lead tssop drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a - - 1.20 a1 0.05 - 0.15 a2 0.80 1.00 1.05 d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref c 0.09 - 0.20 side view end view top view a2 a l l1 d 1 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07mm. 5. dimension d and e1 to be determined at datum plane h. package drawing contact: packagedrawings@atmel.com 8x d 6/22/11 8x, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr c a1
20 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12.3 8ma2 ? 8-pad udfn title drawing no. gpc rev. package drawing contact: packagedrawings@atmel.com 8ma2 ynz b 8ma2, 8-pad, 2 x 3 x 0.6 mm body, thermally enhanced plastic ultra thin dual flat no lead package (udfn) common dimensions (unit of measure = mm) symbol min nom max note d 2.00 bsc e 3.00 bsc d2 1.40 1.50 1.60 e2 1.20 1.30 1.40 a 0.50 0.55 0.60 a1 0.0 0.02 0.05 a2 0.55 c 0.152 ref l 0.30 0.35 0.40 e 0.50 bsc b 0.18 0.25 0.30 3 k 0.20 ? 7/15/11 d2 e2 e e (6x) l (8x) b (8x) pin#1 id a a1 a2 pin 1 id d c k 8 7 6 5 1 2 3 4 1 2 3 4 8 7 6 5
21 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12.4 5ts1 ? 5-lead sot23 drawing no. rev. title gpc package drawing contact: packagedrawings@atmel.com 5ts1 d 5/31/12 5ts1, 5-lead 1.60mm body, plastic thin shrink small outline package (shrink sot) tsz common dimensions (unit of measure = mm) symbol min nom max note a - - 1.00 a1 0.00 - 0.10 a2 0.70 0.90 1.00 c 0.08 - 0.20 3 d 2.90 bsc 1,2 e 2.80 bsc 1,2 e1 1.60 bsc 1,2 l1 0.60 ref e 0.95 bsc e1 1.90 bsc b 0.30 - 0.50 3,4 1. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. dimension e1 does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.15 mm per side. 2. the package top may be smaller than the package bottom. dimensions d and e1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. these dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. this drawing is for general information only. refer to jedec drawing mo-193, variation ab for additional information. 5 4 2 l1 l c end view c a a2 a1 b e plane seating d side view e e1 e1 3 1 top view
22 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 12.5 8u3-1 ? 8-ball vfbga drawing no. rev. title gpc package drawing contact: packagedrawings@atmel.com 8u3-1 e 3/27/12 8u3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, vfbga package gxu common dimensions (unit of measure - mm) symbol min nom max note a 0.73 0.79 0.85 a1 0.09 0.14 0.19 a2 0.40 0.45 0.50 b 0.20 0.25 0.30 2 d 1.50 bsc e 2.0 bsc e 0.50 bsc e1 0.25 ref d 1.00 bsc d1 0.25 ref 1. this drawing is for general information only. 2. dimension ? is measured at maximum solder ball diameter. 3. solder ball composition shall be 95.5sn-4.0ag-.5cu. notes: a2 side view a pin 1 ball pad corner top view e d a1 b 8 solder balls bottom view (d1) d 4 3 2 (e1) 6 e 5 7 pin 1 ball pad corner 1 8 2.
23 atmel at24c04c/08c [datasheet] atmel-8787d-seeprom-at24c04c,08c-datasheet_042013 13. revision history doc. rev. date comments 8787d 04/2013 in the page write description, correct from eight to 16 data words. update ordering code table, footers, and disclaimer page. 8787c 07/2012 correct ordering codes: - at24c04c-wwu11, die sale to at24c04c-wwu11m, wafer sale. - at24c08c-wwu11, die sale to at24c08c-wwu11m, wafer sale. remove wdt from ordering code detail. update atmel logos and disclaimer page. 8787b 05/2012 remove preliminary status. remove a 0 signal from the block diagram. i sb2 parameter measured at 5.5v. in ac characteristics table, changed 1.7v, 2.5v, 2.7v to 1.7 and 5.0v to 2.5v, 2.7v, 5.0v. increase t i maximum value from 50ns to 100ns. endurance parameter is studied at 3.3v, to +25 ? c, page mode. remove serial number read from read operations. update product markings. update 8x and 8u3-1 package drawings. update template. 8787a 10/2011 initial document release.
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